COMMUNICATION MODULE

摘要

A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.

主权项

1. A communication module, comprising:
a circuit substrate having (a) a first high-frequency processing section that processes high-frequency signals related to mobile phone communication, (b) a system section having a baseband processing area that processes baseband signals related to mobile phone communication and an application processing area that processes various types of mobile phone application operations, and (c) a power circuit section that includes a first power circuit section that supplies power to the first high-frequency processing section and a second power circuit section that supplies power to the system section; a sealing member formed on an entire main surface of the circuit substrate, the sealing member covering electronic components mounted on said main surface; a shield layer that is conductive and formed on a surface of the sealing member; a first shield wall that fills a groove formed from a main surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of either one or both of the system section and the power circuit section and a mounting area of the first high-frequency processing section, the first shield wall being connected to the shield layer; and a second shield wall that fills a groove formed from the main surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of the first power circuit section and a mounting area of the second power circuit section, the second shield wall being connected to the shield layer.