发明名称 THERMOELECTRIC HEAT PUMP WITH A SURROUND AND SPACER (SAS) STRUCTURE
摘要 A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.
申请公布号 US2015116943(A1) 申请公布日期 2015.04.30
申请号 US201414525843 申请日期 2014.10.28
申请人 Phononic Devices, Inc. 发明人 Olsson Mattias K-O;Yadav Abhishek;Newman Devon
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项 1. A heat pump, comprising: a surround and spacer (SAS) structure comprising a wall defining a first open side and a second open side; an interconnect board enclosed within the SAS structure, the interconnect board comprising one or more openings from a first surface of the interconnect board to a second surface of the interconnect board, the one or more openings defining locations at which a plurality of thermoelectric modules are to be mounted on the interconnect board; the plurality of thermoelectric modules mounted on the interconnect board at the locations defined by the one or more openings, each thermoelectric module of the plurality of thermoelectric modules having a first side and a second side; a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module of the plurality of thermoelectric modules; and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module of the plurality of thermoelectric modules; wherein a periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and a periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that a compression force applied to the heat pump is absorbed by the SAS structure.
地址 Durham NC US