发明名称 |
CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME |
摘要 |
A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component. |
申请公布号 |
US2015116940(A1) |
申请公布日期 |
2015.04.30 |
申请号 |
US201314068697 |
申请日期 |
2013.10.31 |
申请人 |
General Electric Company |
发明人 |
Kim Joo Han;de Bock Hendrik Pieter Jacobus;Labhart Jay Todd;Chauhan Shakti Singh;Kirk Graham Charles;Connolly Stuart |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A circuit card assembly comprising:
a printed circuit board; at least one electronic component mounted on said printed circuit board; a frame coupled to said printed circuit board such that said electronic component is disposed between said printed circuit board and said frame; a heat transfer device coupled to said frame, wherein said heat transfer device comprises a heat pipe disposed at least in part between said frame and said printed circuit board; and a pivotable brace biasing said heat pipe toward said electronic component to facilitate cooling said electronic component. |
地址 |
Schenectady NY US |