发明名称 CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME
摘要 A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.
申请公布号 US2015116940(A1) 申请公布日期 2015.04.30
申请号 US201314068697 申请日期 2013.10.31
申请人 General Electric Company 发明人 Kim Joo Han;de Bock Hendrik Pieter Jacobus;Labhart Jay Todd;Chauhan Shakti Singh;Kirk Graham Charles;Connolly Stuart
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
主权项 1. A circuit card assembly comprising: a printed circuit board; at least one electronic component mounted on said printed circuit board; a frame coupled to said printed circuit board such that said electronic component is disposed between said printed circuit board and said frame; a heat transfer device coupled to said frame, wherein said heat transfer device comprises a heat pipe disposed at least in part between said frame and said printed circuit board; and a pivotable brace biasing said heat pipe toward said electronic component to facilitate cooling said electronic component.
地址 Schenectady NY US