METHOD FOR MANUFACTURING A DIE ASSEMBLY HAVING A SMALL THICKNESS AND DIE ASSEMBLY RELATING THERETO

摘要

A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.

主权项

1. A method for manufacturing a die assembly, the method comprising:
bonding a first wafer of semiconductor material to a second wafer that includes semiconductor body having an initial thickness, the second wafer including an integrated electronic circuit; reducing the initial thickness of the semiconductor body of the second wafer; and bonding the second wafer to a third wafer, the third wafer including a micro-electromechanical sensing structure.