| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing liquid composition for silicon wafers which enables the achievement of both of the reduction in surface roughness (haze) of a silicon wafer, and the reduction in light point defect (LPD).SOLUTION: A polishing liquid composition for silicon wafers comprises: 0.01-0.5 mass% of silica particles; a nitrogen-containing basic compound; and a water-soluble polymer. The water-soluble polymer includes a combination of a constitutional unit I, a constitutional unit II and a constitutional unit III, or a combination of the constitutional unit I and the constitutional unit III. The water-soluble polymer is a modified PVA containing an alkylene oxy group or a modified PVA containing sulfonic acid; and the ratio [(a+b)/d] of the sum of the mole number "a" of the constitutional unit I, and the mole number "b" of the constitutional unit II to an average addition mole number "d" of the alkylene oxy group in the constitutional unit III is 0.8-10. |
