发明名称 回路基板およびその製造方法
摘要 <p>A circuit board includes a main portion and at least one uneven portion. The main portion is obtained by stacking a plurality of base sheets made of a flexible material in a predetermined direction and subjecting the stacked base sheets to compression bonding. The at least one uneven portion is provided on one of the base sheets. The uneven portion includes a concave portion and a convex portion extending in a direction perpendicular or substantially perpendicular to the predetermined direction. The concave portion is sunken in the predetermined direction. The convex portion protrudes in an opposite direction to the predetermined direction.</p>
申请公布号 JP5708903(B2) 申请公布日期 2015.04.30
申请号 JP20140559021 申请日期 2014.01.10
申请人 发明人
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
代理机构 代理人
主权项
地址