WAFER-LEVEL PACKAGES HAVING VOIDS FOR OPTO-ELECTRONIC DEVICES

摘要

A semiconductor device package is formed by mounting a semiconductor die on an adhesive tape substrate, mounting a sacrificial structure on the adhesive tape substrate, applying molding material on the adhesive tape substrate to embed the die and at least a portion of the at least one sacrificial structure; removing the adhesive tape substrate to define a package assembly, forming a redistribution layer on a surface of the package assembly, and removing sacrificial material to form a void in the molding material having a shape corresponding to a shape of the sacrificial material that was removed.

主权项

1. A method for forming a semiconductor device package, comprising:
mounting at least one semiconductor die on an adhesive tape substrate; mounting at least one sacrificial structure made of a sacrificial material on the adhesive tape substrate; applying molding material on the adhesive tape substrate to embed at least a portion of the at least one semiconductor die and at least a portion of the at least one sacrificial structure; removing the adhesive tape substrate to define a package assembly having at least a portion of the at least one semiconductor die and at least a portion of the at least one sacrificial structure on a first surface of the package assembly; forming at least one metal redistribution layer having a plurality of conductive circuit paths on the first surface of the package assembly, at least a portion of the conductive circuit paths in electrical contact with one or more signal pads of the semiconductor die; and removing at least a portion of the sacrificial material embedded in the molding material to form at least one void in the molding material having a shape corresponding to a shape of the portion of the sacrificial material embedded in the molding material.