发明名称 BUFFER MEMBER, BUFFER FRAME AND ELECTRICAL DEVICE
摘要 A buffer member includes a first buffer portion, a pin, a bending portion and a second buffer portion. The pin is located on the first buffer portion. The bending portion is connected with the first buffer portion. The second buffer portion is connected with the bending portion, and the first buffer portion is connected with the second buffer portion via the bending portion. A reinforcing member is located inside the pin for raising the rigidity of the pin. The pin is used for fixing a vibration source. The first buffer portion and the second buffer portion reduce the transmission of the vibration energy from the vibration source.
申请公布号 US2015117696(A1) 申请公布日期 2015.04.30
申请号 US201414170181 申请日期 2014.01.31
申请人 Wistron Corp. 发明人 LEE Yun-Ping;LU Hsiang-Ming;CHEN Kuan-You;CHEN Wenlong;CHEN Min-Hung
分类号 F16F15/08;H04R1/28;G06F1/16 主分类号 F16F15/08
代理机构 代理人
主权项 1. An electrical device, comprising: a storage device having at least an opening; a frame body, comprising: a lateral plate having an accommodation space for accommodating the storage device, wherein the lateral plate has a perforation hole, an inner side surface and an outer side surface which is opposite to the inner side surface, wherein the inner side surface faces toward the storage device and the perforation hole is formed between the inner side surface and the outer side surface; anda bottom plate connected with the lateral plate, wherein the bottom plate has a top surface and a bottom surface which is opposite to the top surface, and the top surface faces toward the storage device; and a buffer member, comprising: a first buffer portion, wherein the hardness of the first buffer portion is lower than that of the frame body, and the first buffer portion is attached to the outer side surface of the lateral plate;a pin located on the first buffer portion, and the pin passing through the perforation hole and inserting into the opening of the storage device;a bending portion connected with the first buffer portion; anda second buffer portion connected with the bending portion, wherein the first buffer portion is connected with the second buffer portion via the bending portion, and the second buffer portion is attached to the bottom surface of the bottom plate.
地址 New Taipei City TW