| 发明名称 |
METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND LID BODY |
| 摘要 |
A method of manufacturing an electronic device in which a gyro element as an electronic component is accommodated in an internal space provided by a base and a lid as a lid body, includes: preparing the lid as the lid body in which a groove is provided in the surface which is a surface on the opposite side to the rear surface which is a surface on a side which is joined to the base; seam-welding the base and the lid at a site except for an unwelded site which includes a site corresponding to at least a portion of the groove, of a site planned to join the base and the lid; and welding the base and the lid at the unwelded site. |
| 申请公布号 |
US2015116974(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201414528094 |
申请日期 |
2014.10.30 |
| 申请人 |
Seiko Epson Corporation |
发明人 |
MATSUZAWA Juichiro;KAWAUCHI Osamu;AOKI Shinya;MIKAMI Masaru |
| 分类号 |
H05K5/06;H05K5/02;B23K1/00 |
主分类号 |
H05K5/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing an electronic device in which an electronic component is accommodated in an internal space provided by a base and a lid body, comprising:
preparing the lid body in which a groove is provided in a surface on the opposite side to a surface on a side which is joined to the base; seam-welding the base and the lid body at a site except for an unwelded site which includes a site corresponding to at least a portion of the groove, of a site planned to join the base and the lid body; and welding the base and the lid body at the unwelded site. |
| 地址 |
Tokyo JP |
