| 发明名称 |
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME |
| 摘要 |
Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized. |
| 申请公布号 |
US2015114693(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201414195665 |
申请日期 |
2014.03.03 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
Moon Jin Seok;Yun Geum Hee;Jo Dae Hui;Yoo Seong Hyun;Lee Hyun Jun;Kim Jin Young;Sohn Keung Jin |
| 分类号 |
C08L63/00;H05K1/03;H05K1/02;C08L65/02 |
主分类号 |
C08L63/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An insulating resin composition for a printed circuit board comprising:
a naphthalene-based epoxy resin; a bismaleimide resin; a cyanate ester resin; a coupling agent; and an eucryptite inorganic filler. |
| 地址 |
Suwon-Si KR |
