FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD

摘要

A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating layer covering the first sides of the flexible and non-flexible substrates and having an opening exposing a portion of the first side of the flexible substrate, and a second insulating layer covering the second sides of the flexible and non-flexible substrates and having an opening exposing a portion of the second side of the flexible substrate. The first wiring layer includes first conductor pattern on the first side of the flexible substrate, and the second wiring layer includes second conductor pattern extending across the second sides of the flexible and non-flexible substrates.

主权项

1. A flex-rigid wiring board, comprising:
a flexible substrate; a non-flexible substrate positioned such that the non-flexible substrate is extending in a horizontal direction of the flexible substrate; a first wiring layer formed on first surface sides of the flexible substrate and non-flexible substrate; a second wiring layer formed on second surface sides of the flexible substrate and non-flexible substrate; a first insulating layer covering the first surface side of the flexible substrate and the first surface side of the non-flexible substrate and having an opening portion exposing at least a portion of the first surface side of the flexible substrate; and a second insulating layer covering the second surface side of the flexible substrate and the second surface side of the non-flexible substrate and having an opening portion exposing at least a portion of the second surface side of the flexible substrate, wherein the first wiring layer includes a first conductor pattern formed on the first surface side of the flexible substrate, and the second wiring layer includes a second conductor pattern extending across the second surface side of the flexible substrate and the second surface side of the non-flexible substrate.