| 发明名称 |
BONDING FORCE TEST DEVICE |
| 摘要 |
Disclosed herein is a bonding force test device, including: a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested. |
| 申请公布号 |
US2015114131(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201414188183 |
申请日期 |
2014.02.24 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Cha Jin Uk;Kim Gyu Seok;Yang Eun Ju;Kim Mi Yang;Ham Suk Jin |
| 分类号 |
G01N3/24;H02N2/10;G01N3/04 |
主分类号 |
G01N3/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonding force test device, comprising:
a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested. |
| 地址 |
Suwon-si KR |
