METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE

摘要

A method of manufacturing a resin multilayer substrate with a cavity, includes stacking insulation substrates including thermoplastic resins and thermocompression-bonding the insulation substrates. At least one of the insulation substrates is formed by affixing a peelable carrier film to one main surface of the insulation substrate, making a cut in the insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the insulation substrate in a thickness direction and not penetrating the carrier film in a thickness direction, and removing the carrier film and a portion of the insulation substrate that is cut out by the cut.

主权项

1. A method of manufacturing a resin multilayer substrate including a cavity, the method comprising the steps of:
stacking a plurality of insulation substrates including thermoplastic resins; and thermocompression-bonding the plurality of insulation substrates; wherein at least one insulation substrate of the plurality of insulation substrates is manufactured by a method including:
affixing a peelable carrier film to one main surface of the at least one insulation substrate;making a cut in the at least one insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the at least one insulation substrate in a thickness direction; andremoving the carrier film and a portion of the at least one insulation substrate that is cut out by the cut.