发明名称 |
FILM DEPOSITION DEVICE OF METAL FILM AND METAL FILM DEPOSITION METHOD |
摘要 |
A film deposition device (1 A) of a metal film (F) includes a positive electrode (11), a solid electrolyte membrane (13), and a power supply part (14) that applies a voltage between the positive electrode (11) and a base material (B) to be a negative electrode. The solid electrolyte membrane (13) allows a water content to be 15% by mass or more and is capable of containing a metal ion. The power supply part (14) applies a voltage between the positive electrode and the base material in a state where the solid electrolyte membrane is disposed on a surface of the positive electrode such that metal made of metal ions contained inside the solid electrolyte membrane (13) is precipitated on a surface of the base material (B). |
申请公布号 |
WO2015019154(A3) |
申请公布日期 |
2015.04.30 |
申请号 |
WO2014IB01459 |
申请日期 |
2014.08.04 |
申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
SATO, YUKI;YANAGIMOTO, HIROSHI;HIRAOKA, MOTOKI |
分类号 |
C25D5/08;C25D3/38;C25D17/00;C25D17/12 |
主分类号 |
C25D5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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