发明名称 PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE PROVIDED WITH PRINTED CIRCUIT BOARD, AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD
摘要 <p>In order to provide a newly structured printed circuit board in which a sheet metal member can be more easily and reliably mounted by a mounter, and an electronic device provided therewith, and provide a new manufacturing method for such a printed circuit board, in a sheet metal member (14) to be provided so as to stand on a substrate (12), lead securing parts (22a, 22b) to be inserted into through holes (38a, 38b) of the substrate (12) and soldered, and a surface securing part (32) having a flat-shaped section (34) to be superposed on the surface (42) of the substrate (12) and soldered are provided, and the lead securing parts (22a, 22b) are provided at positions close to a grip part (30) to be gripped by a mounter (46), while the surface securing part (32) is provided at a position far from the grip part (30).</p>
申请公布号 WO2015060085(A1) 申请公布日期 2015.04.30
申请号 WO2014JP76282 申请日期 2014.10.01
申请人 SUMITOMO WIRING SYSTEMS, LTD. 发明人 KAMATA, MASASHI
分类号 H05K1/18;H01Q1/24;H01R4/02;H05K3/34;H05K7/06;H05K13/04 主分类号 H05K1/18
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