| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and system for generating an inspection process for a wafer.SOLUTION: The method comprises the steps of: separately determining a value of a local attribute for different locations in a design for a wafer on the basis of a defect that can cause at least one type of fault mechanism at the different locations; determining a sensitivity with which defects will be reported for different locations on the wafer corresponding to the different locations in the design on the basis of the value of the local attribute; and inspecting the wafer on the basis of the determined sensitivity. Groups may be generated on the basis of the value of the local attribute, so that pixels that have at least similar noise statistics are assigned to the same group, and thus the groups are important for defect detection algorithms. |
