发明名称 半導体発光装置
摘要 <P>PROBLEM TO BE SOLVED: To solve the problems that a void and a crack are generated when white ceramic mixing reflective fine particles into an inorganic binder for ensuring high reflectance is thickly applied on a circuit substrate, and that white ceramic ink is easy to peel off from the circuit substrate because it is hard, even if the white ceramic ink is made to be two layers so as to avoid generating the void and the crack. <P>SOLUTION: An LED device 10 has an electrode 17 on an upper surface of a circuit substrate 22, and comprises at least a white resist layer 16 for covering a part of the electrode 17, and a white ceramic ink layer 15 for covering the white resist layer 16. Consequently, a reflection member made by a laminated body of the white resist layer 16 and the white ceramic ink layer 15 has high reflectance and light resistance, and a soft white resist layer 16 becomes a buffer to make the reflection member hard to peel off from the circuit substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5710915(B2) 申请公布日期 2015.04.30
申请号 JP20100201786 申请日期 2010.09.09
申请人 シチズンホールディングス株式会社;シチズン電子株式会社 发明人 田村 量
分类号 H01L33/60 主分类号 H01L33/60
代理机构 代理人
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