| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an element provided with input-output terminals having a wiring conductor and a coplanar conductor, which solves the possible problem of a short circuit between the wiring conductor and the coplanar conductor due to need for narrowing a distance between the conductors when transmitting signals having higher frequency components.SOLUTION: The package for housing the element comprises an insulative substrate, a second wiring conductor disposed on a top face of the insulative substrate, and a coplanar wiring board having a pair of coplanar conductors disposed on the top face of the insulative substrate so as to sandwich the second wiring conductor and disposed on a top face of a base substrate between a mount region and input-output terminals to electrically connect a semiconductor element and the input-output terminal. |
