发明名称 積層型チップ部品
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laminate type chip component mounted to the surface of a circuit board and easily embedded even in the inner part of the circuit board. <P>SOLUTION: The laminate type chip component 2 includes an element body 4 with internal electrodes 12 formed therein, terminal electrodes 6, 8 for covering the end surface of the element body 4 where the internal electrodes 12 are exposed, and connection electrodes 16, 18 partially coupled with the terminal electrodes 6, 8 and physically and electrically connected to an external circuit conductor. The terminal electrodes 6, 8 include end surfaces 6a, 8a positioned on end surfaces of the element body 4 and side surfaces 6b, 8b continuously formed from the end surfaces 6a, 8a and extended to four side surfaces close to the end surfaces of the element body 4. The connection electrodes 16, 18 are constituted of metal. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP5707710(B2) 申请公布日期 2015.04.30
申请号 JP20100050796 申请日期 2010.03.08
申请人 TDK株式会社 发明人 斎藤 洋;簗田 壮司;相庭 尚;佐藤 義彦
分类号 H01C7/18;H01C7/10;H01G4/30 主分类号 H01C7/18
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