| 发明名称 |
SUBSTRATE RAW MATERIAL AND METHOD FOR MANUFACTURING THE SAME, AND CIRCUIT BOARD MANUFACTURED USING THE SAME |
| 摘要 |
The present invention relates to a substrate raw material such as a copper clad laminate for manufacturing a circuit board. A substrate raw material in accordance with an embodiment of the present invention includes an insulating layer and an organic fiber cloth disposed in the insulating layer. |
| 申请公布号 |
US2015118474(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201414162045 |
申请日期 |
2014.01.23 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
PARK Jung Hwan;LIM Sung Taek;KIM Dong Hoon |
| 分类号 |
H05K1/03;B29B15/10 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate raw material for manufacture of a circuit board, comprising:
an insulating layer; and an organic fiber cloth disposed in the insulating layer. |
| 地址 |
Suwon KR |
