发明名称 INDUCTION HEATING COOKING DEVICE
摘要 In order to provide an induction heating cooking device in which a supporting configuration of a heating coil unit is simple and can be easily assembled, and which can accurately and constantly maintain a distance between a top plate and heating coils, opposite side surfaces of a framework laid out below the top plate are configured to have first vertical parts, first horizontal parts, and second vertical parts. A heating coil supporting member that supports the heating coils is disposed to be bridged between the first horizontal parts of the opposite side surfaces of the framework, and the heating coil unit having the heating coil is configured to be securely supported by the first horizontal parts.
申请公布号 US2015114953(A1) 申请公布日期 2015.04.30
申请号 US201414408224 申请日期 2014.03.10
申请人 Panasonic Intellectual Property Management Co., 发明人 Suzuki Hidekazu;Takahashi Tomoya;Ogawa Kenji;Isago Hiroshi;Ando Shumpei;Yokono Masahiro;Nagata Ryuuji;Aihara Katsuyuki;Ushio Shozo
分类号 H05B6/12 主分类号 H05B6/12
代理机构 代理人
主权项 1. An induction heating cooking device comprising: a top plate on which an object to be heated is placed; a framework which has an opening portion of an approximately rectangular shape above, which is formed in a box shape by a bottom surface and side surfaces, and which has the top plate provided above; and a heating coil unit which is provided inside the framework, and which has a heating coil that induction heats the object to be heated and a heating coil supporting member that supports the heating coil, wherein at least a set of opposite side surfaces of the framework are configured to have first vertical parts that are formed by being bent upward at outer edge parts of the bottom surface, first horizontal parts that are formed by being bent to an outer side at upper edge parts of the first vertical parts; and second vertical parts that are bent upward at outer edge parts of the first horizontal parts and form the opening portion by upper edge parts, and the heating coil unit is configured to be supported by the first horizontal parts.
地址 Osaka-shi, Osaka JP