发明名称 発光素子
摘要 Disclosed are a light emitting diode, a method of manufacturing the same, a light emitting device and a method of manufacturing the same. The light emitting device includes a circuit board formed with a first conductive pattern and a second conductive pattern electrically isolated from the first conductive pattern; a light emitting diode electrically connected to the first and second conductive patterns on the circuit board; a first molding member surrounding the light emitting diode; and a second molding member on the first molding member. The light emitting diode includes a conductive support substrate, a reflective electrode layer having a convex center portion on the conductive support substrate, a protective layer on a peripheral portion of the reflective electrode layer, a second conductive semiconductor layer on the reflective layer and the protective layer, an active layer on the second conductive semiconductor layer, a first conductive semiconductor layer on the active layer, and a first electrode layer on the first conductive semiconductor layer.
申请公布号 JP5709778(B2) 申请公布日期 2015.04.30
申请号 JP20120031778 申请日期 2012.02.16
申请人 エルジー イノテック カンパニー リミテッド 发明人 パク・ジュンスク;キム・トゥンクワン;シン・ハン
分类号 H01L33/10;H01L33/32;H01L33/50;H01L33/54;H01L33/58 主分类号 H01L33/10
代理机构 代理人
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