| 摘要 |
<p>The present invention provides a divided sputtering target obtained by joining a plurality of target members, whereby it is possible to effectively prevent contamination of the formed thin formed by the constituent material of the backing plate, as a result of sputtering. The present invention is a divided sputtering target obtained by joining a plurality of target materials on a backing plate by means of low-temperature soldering, wherein a protective member is provided to the backing plate along the gap formed between the joined target members.</p> |
