SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES

摘要

A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.

主权项

1. A laminating device for laminating semiconductor die onto substrates on a substrate panel, the laminating device comprising:
a plurality of lamination units, each lamination unit in the plurality of lamination units including an actuator and a lamination head, the actuator actuating the lamination head to exert a force on a semiconductor die, wherein the lamination heads of the plurality of lamination units are actuated independently of each other.