HARDENER FOR EPOXY RESIN AND THE PREPARING METHOD THEREOF

摘要

The present invention relates to an epoxy curing agent and, more particularly, to an epoxy curing agent that can be used widely in electrical and electronic fields as a cured product by the curing agent according to the present invention has electrical properties such as a dielectrical constant and dielectric dissipation improved significantly while simultaneously having a high glass transition temperature, low hygroscopicity, excellent adhesiveness, high peel strength and a low coefficient of thermal expansion.