发明名称 |
Thermal expansion resin composition |
摘要 |
[Problem] To provide a thermal expansion resin composition which gives molded bodies having excellent flame resistance and stress at break, and relatively low elasticity. [Solution] This thermal expansion resin composition contains an epoxy resin, a thermally expandable graphite, and an inorganic filler. The epoxy compound contained in the epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99. This thermal expansion resin can be applied in refractory coating materials for pillars, beams and walls, in fireproof |
申请公布号 |
AU2013328110(A1) |
申请公布日期 |
2015.04.30 |
申请号 |
AU20130328110 |
申请日期 |
2013.10.10 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
YOSHITAKE, TOSHITAKA;TONO, MASAKI;OTSUKA, KENJI;YANO, HIDEAKI |
分类号 |
C08L63/00;C08G59/20;C08K3/00;C08K3/04 |
主分类号 |
C08L63/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|