发明名称 Thermal expansion resin composition
摘要 [Problem] To provide a thermal expansion resin composition which gives molded bodies having excellent flame resistance and stress at break, and relatively low elasticity. [Solution] This thermal expansion resin composition contains an epoxy resin, a thermally expandable graphite, and an inorganic filler. The epoxy compound contained in the epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99. This thermal expansion resin can be applied in refractory coating materials for pillars, beams and walls, in fireproof
申请公布号 AU2013328110(A1) 申请公布日期 2015.04.30
申请号 AU20130328110 申请日期 2013.10.10
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 YOSHITAKE, TOSHITAKA;TONO, MASAKI;OTSUKA, KENJI;YANO, HIDEAKI
分类号 C08L63/00;C08G59/20;C08K3/00;C08K3/04 主分类号 C08L63/00
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