| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable electronic component package and a manufacturing method therefor, capable of preventing problems such as the exfoliation of a sealing resin when an external force is applied to the package. <P>SOLUTION: The electronic component package includes: an electronic component connected to a substrate; and a first sealing resin for sealing a connection portion between the electronic component and the substrate, which is shape controlled with a liquid-repellent pattern formed on the substrate. The electronic component package is sealed with a second sealing resin adhered to both the surface of the first sealing resin and the substrate surface in the periphery of the first sealing resin formation portion. The liquid-repellent pattern only exists between the first sealing resin and the substrate. With this, no liquid-repellent pattern is existent between the second sealing resin and the substrate, causing no reduction of adhesion of the second sealing resin to the substrate. Thus, the highly reliable electronic component package is obtained. <P>COPYRIGHT: (C)2012,JPO&INPIT |
