发明名称 基板処理装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of effectively achieving the uniformization of treatment on the whole surface of a substrate by preventing the stagnation of the treatment solution discharged to the surface of the substrate. <P>SOLUTION: In the substrate treatment apparatus equipped with spray pipe parts 22 and a plurality of spray nozzles 14 formed adjacently in a row in the longitudinal direction of the spray pipe parts 22 and constituted of a plurality of nozzle parts 24 for discharging the treatment solution to the surface 102 of the substrate W from the discharge ports 26 thereof, the plurality of the nozzle parts 24 are formed to a plurality of the spray pipe parts 22 so that the facing angles of the discharge ports 26 of the plurality of the nozzle parts 24 to the surface 102 of the substrate W fed in a horizontal posture become gradually large with respect to a vertical line from the vicinity of the central part in the direction crossing the substrate feed direction X of the surface 102 of the substrate W fed in the horizontal posture to the vicinity of both end parts to generate the positive flow of the treatment solution after discharge on the surface 102 of the substrate W. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5710921(B2) 申请公布日期 2015.04.30
申请号 JP20100211716 申请日期 2010.09.22
申请人 发明人
分类号 B08B3/04;B05B13/02;G03F7/30;H01L21/027;H01L21/677 主分类号 B08B3/04
代理机构 代理人
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