| 发明名称 |
Film-Like Thermosetting Silicone Sealing Material |
| 摘要 |
The present invention relates to a film-like thermosetting silicone sealing material for sealing a semiconductor element by means of compression molding, the sealing material having an initial torque value of less than 15 dN·m as measured by an MDR (Moving Die Rheometer) at a molding temperature of from room temperature to 200° C., to a method for producing an LED by means of compression molding using the same, and to an LED produced by this method. The sealing material has excellent moldability, causes no problems such as overflow from a die, and has no defects such as voids. |
| 申请公布号 |
US2015115311(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201314397688 |
申请日期 |
2013.04.23 |
| 申请人 |
Dow Corning Toray Co., Ltd. |
发明人 |
Yoshida Shin;Amako Masaaki |
| 分类号 |
C08K5/5435;H01L33/56;H01L21/02 |
主分类号 |
C08K5/5435 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A film-like thermosetting silicone sealing material for sealing a semiconductor element by compression molding, wherein the sealing material has an initial torque value of less than 15 dN·m as measured by a Moving Die Rheometer (MDR) at a molding temperature of from room temperature to 200° C. |
| 地址 |
Tokyo JP |
