| 摘要 |
The invention relates to a cooling device for power electronic devices, comprising at least one heat sink in the form of a cooling plate, which cooling plate is in contact with at least one power electronic component to be cooled, and comprising a coolant line, through which a coolant can flow and which leads through the cooling plate, wherein flow-determining means are provided for determining the flow rate of the flow through the heat sink. According to the invention, the coolant line has a cross-sectional taper in the coolant plate, wherein at least two measurement connections are provided for connecting a differential pressure measuring device for measuring a pressure difference at the two measurement connections, of which one is provided on the cooling plate at or immediately downstream of said cross-sectional taper. The flow-determining means comprise an evaluating device for determining the flow rate from the measured pressure difference. In particular, the cross-sectional taper is designed in the form of a venturi element, wherein the narrow point after the taper and the broad point before the taper are each tapped by means of a measurement connection in order to determine the pressure difference arising across the venturi nozzle. |
