PHENOLIC RESIN, EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, AND CURED PRODUCT THEREOF

摘要

The purpose of the present invention is to provide: a resin which has heat-conducting properties, heat resistance and solubility in solvents; and a cured product of the resin. A phenolic resin according to the present invention is produced by condensing a phenol compound represented by general formula (1) with a polyformylphenyl derivative represented by general formula (2), and has a weight average molecular weight of 500 to 3,000 g/eq. as measured by gel permeation chromatography (GPC). (In the formula, R1 and R2 independently represent a hydrogen atom or the like; and n represents an integer of 2 to 5.)