发明名称 Method for forming self-aligning local interconnects in integrated circuits
摘要 Methods, structures and designs for self-aligned local interconnects are provided. The method includes designing diffusion regions to be in a substrate. Some of a plurality of gates (74) are designed to be active gates and some of the plurality of gates are designed to be formed over isolation regions (180). The method includes designing the plurality of gates in a regular and repeating alignment along a same direction, and each of the plurality of gates are designed to have dielectric spacers (230). The method also includes designing a local interconnect layer (196) between or adjacent to the plurality of gates. The local interconnect layer is conductive and disposed over the substrate to allow electrical contact and interconnection with or to some of the diffusion regions (184) of the active gates. The local interconnect layer is self-aligned by the dielectric spacers of the plurality of gates.
申请公布号 EP2592649(B1) 申请公布日期 2015.04.29
申请号 EP20130154842 申请日期 2008.10.20
申请人 TELA INNOVATIONS, INC. 发明人 SMAYLING, MICHAEL C;BECKER, SCOTT T
分类号 H01L21/8234;G03F1/00;G06F17/50;H01L21/285;H01L21/768;H01L21/8238;H01L27/088 主分类号 H01L21/8234
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