发明名称 IC TAGGED COMPOUND CONTAINER LID
摘要 A composite container lid for a packing container, which comprises an inner cap 30 fitted onto the container mouth portion 20, an over-cap 40 fitted onto the inner cap 30, and an IC tag 10, wherein an engaging means is provided between the inner surface of a skirt 42 of the over-cap 40 and the outer surface of a cylindrical wall 32 of the inner cap 30, the IC tag 10 comprises a resin film 1 that includes an IC chip 3, an antenna 5 and an unsealing detector circuit 9, and the IC tag 10 is attached to the inner cap 30 or to the over-cap 40 in a manner that the unsealing detector circuit 9 is broken by the motion of the over-cap 40 relative to the inner cap 30 caused in the step of unsealing the inner cap 30.
申请公布号 EP2865607(A1) 申请公布日期 2015.04.29
申请号 EP20130810735 申请日期 2013.06.25
申请人 TOYO SEIKAN GROUP HOLDINGS, LTD.;NIPPON CLOSURES CO., LTD. 发明人 ARAI, TOSHIYUKI;KUROSAWA, TAKAHIRO;KIKUCHI, TAKAYUKI;SAHARA, TORU;SUGI, MAMIKO
分类号 B65D55/02;B65D41/34;B65D51/24;G06K19/07 主分类号 B65D55/02
代理机构 代理人
主权项
地址