发明名称 |
IC TAGGED COMPOUND CONTAINER LID |
摘要 |
A composite container lid for a packing container, which comprises an inner cap 30 fitted onto the container mouth portion 20, an over-cap 40 fitted onto the inner cap 30, and an IC tag 10, wherein an engaging means is provided between the inner surface of a skirt 42 of the over-cap 40 and the outer surface of a cylindrical wall 32 of the inner cap 30, the IC tag 10 comprises a resin film 1 that includes an IC chip 3, an antenna 5 and an unsealing detector circuit 9, and the IC tag 10 is attached to the inner cap 30 or to the over-cap 40 in a manner that the unsealing detector circuit 9 is broken by the motion of the over-cap 40 relative to the inner cap 30 caused in the step of unsealing the inner cap 30. |
申请公布号 |
EP2865607(A1) |
申请公布日期 |
2015.04.29 |
申请号 |
EP20130810735 |
申请日期 |
2013.06.25 |
申请人 |
TOYO SEIKAN GROUP HOLDINGS, LTD.;NIPPON CLOSURES CO., LTD. |
发明人 |
ARAI, TOSHIYUKI;KUROSAWA, TAKAHIRO;KIKUCHI, TAKAYUKI;SAHARA, TORU;SUGI, MAMIKO |
分类号 |
B65D55/02;B65D41/34;B65D51/24;G06K19/07 |
主分类号 |
B65D55/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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