| 摘要 |
<p>Provided are a printed circuit board which can be used as a substrate for a package, a method of manufacturing the printed circuit board, and a semiconductor package using the printed circuit board, the printed circuit board including: a first substrate (10) having a first mounting area for mounting a package substrate and a second mounting area for mounting a semiconductor element; a single layer or multi-layered circuit pattern of the first substrate (10); and a post bump (30; 301) connected to the circuit pattern, provided on an external insulating layer (11) of the first mounting area, and having a concave upper surface.</p> |
