发明名称 |
A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING INORGANIC PARTICLES AND POLYMER PARTICLES |
摘要 |
A chemical mechanical polishing (CMP) composition, comprising (A) at least one type of inorganic particles which are dispersed in the liquid medium (C), (B) at least one type of polymer particles which are dispersed in the liquid medium (C), (C) a liquid medium, wherein the zeta-potential of the inorganic particles (A) in the liquid medium (C) and the zeta-potential of the polymer particles in the liquid medium (C) are of same signs. |
申请公布号 |
EP2499210(A4) |
申请公布日期 |
2015.04.29 |
申请号 |
EP20100829604 |
申请日期 |
2010.11.10 |
申请人 |
BASF SE |
发明人 |
LAUTER, MICHAEL;RAMAN, VIJAY IMMANUEL;LI, YUZHUO;VENKATARAMAN, SHYAM SUNDAR;SHEN, DANIEL KWO-HUNG |
分类号 |
C09G1/02;C09G1/16;C09K3/14 |
主分类号 |
C09G1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|