| 摘要 |
The present invention addresses the problem of providing an LED device having no color unevenness in light emission. In order to solve the problem, this LED device manufacturing method includes: a step of providing an LED chip-mounted package; a step of film-forming a fluorescent material layer by applying a fluorescent material-dispersed solution to a emission surface of the LED chip, said fluorescent material-dispersed solution containing a solvent, a fluorescent material, clay minerals and porous inorganic particles, and by drying the fluorescent material-dispersed solution; and a step of film-forming a wavelength conversion section by applying, to the fluorescent material layer, a precursor solution having a precursor of a light transmissive ceramic dispersed in a solvent, and by firing the layer, said wavelength conversion section being composed of a light transmissive ceramic layer having the fluorescent material, the clay minerals and the porous inorganic particles dispersed therein. |
