发明名称 |
LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE |
摘要 |
According to the invention, a liquid resin composition which has favorable wet spreadability after mounting of a chip and exhibits excellent solder cracking resistance even in a high-temperature solder reflow process at about 260°C, i.e., even when being used in lead-free solder, and a semiconductor package using the liquid resin composition are provided. In the liquid resin composition of the invention, an acrylic copolymer having a radical polymerizable functional group contains alkyl (meth)acrylate as a constituent monomer having a linear or branched alkyl group having 6 to 9 carbon atoms in an amount of 10 wt% to 40 wt% of the entire constituent monomers. |
申请公布号 |
EP2624287(A4) |
申请公布日期 |
2015.04.29 |
申请号 |
EP20110829004 |
申请日期 |
2011.09.26 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
MAKIHARA KOUJI;MURAYAMA RYUICHI |
分类号 |
H01L21/52;C08F290/12;C09J11/00;C09J133/06;C09J133/14 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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