发明名称 CONDUCTIVE-PATTERN FORMATION METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN VIA LIGHT EXPOSURE OR MICROWAVE HEATING
摘要 Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.
申请公布号 EP2785158(A4) 申请公布日期 2015.04.29
申请号 EP20120851695 申请日期 2012.11.26
申请人 SHOWA DENKO K.K. 发明人 UCHIDA, HIROSHI
分类号 H05K3/12;B05D3/02;B05D5/12;B05D7/24;C09D11/00;H01B1/00;H01B1/20;H01B13/00 主分类号 H05K3/12
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