| 摘要 |
The purpose of the present invention is to provide a thin film deposition apparatus and a thin film deposition method capable of remarkably increasing a production speed and reducing the installation space of the apparatus by forming a thin film on the surface of a substrate by a relative rotation with regard to a gas spray unit when multiple rectangular substrates are supported on one substrate support unit. The present invention provides the thin film deposition apparatus which includes: a vacuum chamber, the gas spray unit which is installed on the upper side or lower side of the vacuum chamber and supplies a gas to deposit the thin film on the surface of the substrate, and the substrate support unit which is installed in the vacuum chamber to relatively and horizontally rotate with regard to the gas spray unit and supports two or more rectangular substrates arranged in a circumferential direction along the rotation center. |
