| 摘要 |
<p>The present invention relates to a sensor package which is designed to reduce the whole thickness thereof by receiving a sensor chip in an inner space with a concave shape on the lower side of a metal frame. The sensor chip is in contact with a surrounding environment through the opening part of the metal frame. An adhesive layer or a polymer layer is interposed on the inner side of the metal frame. The present invention includes a conduction part which electrically connects the metal frame and the sensor chip by passing through the adhesive layer and the polymer layer.</p> |
