| 摘要 |
<p>A photonic integrated device and method of providing a photonic integrated device. The device comprises: a temperature sensitive component and a thermoelectric module. The thermoelectric module is formed adjacent the temperature sensitive component and is configured to adjust the temperature of the temperature sensitive component. The first aspect recognises that locating and forming a thermoelectric module adjacent a temperature-sensitive component can be advantageous in dealing with heat generated on an integrated circuit. Furthermore, arranging the thermoelectric module to adjust the temperature of the temperature-sensitive component may negate the need to provide both a thermoelectric module to cool a temperature-sensitive device and a local electric heater adjacent a device. That is to say, the two components may be replaced with a single integrated component in accordance with the first aspect.</p> |
