发明名称 A CARD BODY, A MANUFACTURING METHOD FOR AN IC CARD, AND THE IC CARD
摘要 According to one embodiment, a card body (10) includes a card part (11) onto which an IC module (21) is to be mounted, and a bracket part (18) to support the card part. The card part (11) includes a bevel (17). The bracket part (18) includes a hole (12), a first bridge part (13), a second bridge part (15), a first break-off line (14), and a second break-off line (16). The hole (12) is formed at a circumference of the card part. The first bridge part (13) connects the bracket part and the card part. The second bridge part (15) connects the bracket part (18) and the card part (11) . The second bridge part (15) is provided at a position further away from the bevel (17) than the first bridge part (13) . The first break-off line (14) is provided with a first depth at the first bridge part (13). The second break-off line (16) is provided with a second depth at the second bridge part (15). The second depth is shallower than the first depth.
申请公布号 SG10201405176S(A) 申请公布日期 2015.04.29
申请号 SG10201405176S 申请日期 2014.08.25
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HIDEAKI ARAI
分类号 G06K19/077 主分类号 G06K19/077
代理机构 代理人
主权项
地址