| 摘要 |
<p>The present invention relates to a method of forming a coating layer of a semiconductor device, a semiconductor device and a method of manufacturing the same. Specifically, since the photoresist is applied after removing the moisture remaining on a wafer as a pretreatment of coating, the present invention has an advantage of improving the adhesiveness of the photoresist, easily adjusting the desired thickness of the photoresist and reducing the application amount of the photoresist.</p> |
