发明名称 Electrical subsea node
摘要 An electrical subsea node for communicating data between at least one sensor at a sea bottom and a topside unit above the sea surface may include: a water tight container; a first electronic module extending in a first area of a first area size in a plane of a maximal spatial extent of the first electronic module; and at least one second electronic module extending in a second area of a second area size in a plane of a maximal spatial extent of the second electronic module, wherein the first and second electronic modules are coupled for data communication and arranged inside the container to form a module arrangement extending in an arrangement area of an arrangement area size in a plane of a maximal spatial extent of the module arrangement, wherein the arrangement area size is smaller than a sum of the first and second area sizes.
申请公布号 US9019712(B2) 申请公布日期 2015.04.28
申请号 US201113876458 申请日期 2011.02.07
申请人 Siemens Aktiengesellschaft 发明人 Eriksen Mikael Kristian;Kristiansen Karstein;Volent Kjetil Zsolt
分类号 H05K5/00;H05K1/14;H05K7/14;E21B33/035;H02G3/08;H02G9/02;H05K5/06;H05K3/36 主分类号 H05K5/00
代理机构 King & Spalding L.L.P. 代理人 King & Spalding L.L.P.
主权项 1. Electrical subsea node for communicating data between at least one sensor at a bottom of a sea and a topside unit above a surface of the sea, the electrical subsea node comprising: a water tight container; a first electronic module extending in a first area of a first area size in a plane of a maximal spatial extent of the first electronic module; and at least one second electronic module extending in a second area of a second area size in a plane of a maximal spatial extent of the second electronic module, wherein the second electronic module is coupled to the first electronic module for data communication, wherein the first electronic module and the second electronic module are arranged inside the container to form a module arrangement extending in an arrangement area of an arrangement area size in a plane of a maximal spatial extent of the module arrangement, wherein the arrangement area size is smaller than a sum of the first area size and the second area size, wherein the first electronic module is implemented on a first printed circuit board having a rectangular shape, and the second electronic module is implemented on a second printed circuit board having a rectangular shape, wherein the first printed circuit board has a same length as the second printed circuit board but a different width than the second printed circuit board, wherein the container has a cylindrical shape having an inside cylinder height and an inside cylinder diameter, wherein a length direction of the first printed circuit board runs parallel to a cylinder height direction and wherein a length direction of the second printed circuit board runs parallel to the cylinder height direction.
地址 Munich DE