Semiconductor module system having encapsulated through wire interconnect (TWI)

摘要

A semiconductor module system includes a module substrate and a semiconductor substrate having a through wire interconnect bonded to an electrode on the module substrate. The through wire interconnect includes a via, a wire in the via having a first end bonded to a substrate contact on the semiconductor substrate and a polymer layer at least partially encapsulating the wire. The semiconductor module system can also include a second substrate stacked on the semiconductor substrate having a second through wire interconnect in electrical contact with the through wire interconnect.

主权项

1. A semiconductor module system comprising:
a module substrate having an electrode; a semiconductor substrate on the module substrate having a first side, a second side, a substrate contact on the first side, and an integrated circuit in electrical communication with the substrate contact; and a through wire interconnect on the semiconductor substrate comprising a via extending through the semiconductor substrate from the first side to the second side thereof, a wire in the via having a first end with a bonded connection to the substrate contact, a portion in electrical contact with the electrode on the module substrate and a second end proximate to the second side of the semiconductor substrate, and a polymer layer on the first side at least partially encapsulating the wire.