Electronic device and a method for fabricating an electronic device

摘要

An electronic device includes a semiconductor chip. A contact element, an electrical connector, and a dielectric layer are disposed on a first surface of a conductive layer facing the semiconductor chip. A first conductive member is disposed in a first recess of the dielectric layer. The first conductive member electrically connects the contact element of the semiconductor chip with the conductive layer. A second conductive member is disposed in a second recess of the dielectric layer. The second conductive member electrically connects the conductive layer with the electrical connector.

主权项

1. An electronic device, comprising:
a semiconductor chip comprising a contact element; an electrical connector spaced from the semiconductor chip; a conductive layer; a dielectric layer disposed on a first surface of the conductive layer facing the semiconductor chip, wherein a portion of the dielectric layer is disposed on one or more of a side face of the semiconductor chip or a side face of the electrical connector; a first conductive member disposed in a first recess of the dielectric layer, the first conductive member electrically connecting the contact element of the semiconductor chip with the conductive layer; and a second conductive member disposed in a second recess of the dielectric layer, the second conductive member electrically connecting the conductive layer with the electrical connector.