| 发明名称 | Methods of forming patterns on a substrate | ||
| 摘要 | A method of forming patterns on a substrate, the method including: placing a mask having an opening defining a portion of one surface of a substrate on which patterns are to be formed on the substrate; forming a first modification layer in the opening by ejecting a surface modification ink onto a surface of the substrate through the opening; ejecting a target ink having droplets of sizes larger than those of a surface modification ink such that the target ink is distributed on the first modification layer in the opening; and removing the mask. | ||
| 申请公布号 | US9018036(B2) | 申请公布日期 | 2015.04.28 |
| 申请号 | US201213448438 | 申请日期 | 2012.04.17 |
| 申请人 | Samsung Electronics Co., Ltd. | 发明人 | Kim Joong-hyuk;Kang Sung-gyu;Lee Seung-ho;Chung Jae-woo;Hong Young-ki |
| 分类号 | H01L51/40;B41J2/16 | 主分类号 | H01L51/40 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A method of forming patterns on a substrate, the method comprising: placing a mask having an opening defining a portion of one surface of a substrate on which patterns are to be formed on the substrate; forming a first modification layer in the opening by ejecting a surface modification ink onto a surface of the substrate through the opening; ejecting a target ink having droplets of sizes larger than those of a surface modification ink such that the target ink is distributed on the first modification layer in the opening; and removing the mask. | ||
| 地址 | Gyeonggi-Do KR | ||