Non-lithographic formation of three-dimensional conductive elements

摘要

A method of forming a conductive element on a substrate and the resulting assembly are provided. The method includes forming a groove in a sacrificial layer overlying a dielectric region disposed on a substrate. The groove preferably extends along a sloped surface of the substrate. The sacrificial layer is preferably removed by a non-photolithographic method, such as ablating with a laser, mechanical milling, or sandblasting. A conductive element is formed in the groove. The grooves may be formed. The grooves and conductive elements may be formed along any surface of the substrate, including within trenches and vias formed therein, and may connect to conductive pads on the front and/or rear surface of the substrate. The conductive elements are preferably formed by plating and may or may not conform to the surface of the substrate.

主权项

1. An assembly comprising:
a substrate having a first planar surface, a second planar surface extending in a lateral direction and separated from the first planar surface in the lateral direction, and a sloped surface extending at least partly in the lateral direction from the first planar surface toward the second planar surface, the substrate including a region of dielectric material at at least the sloped surface of the substrate; an elongated groove extending at least partly in the lateral direction from the first planar surface towards the second planar surface along a surface of the dielectric region exposed at at least the sloped surface, the groove having a floor and walls elongated in a direction parallel to the sloped surface, the walls extending from the floor to the sloped surface; and a conductive element having cross-sectional dimensions at least partly defined by the groove and extending from the floor of the groove to a height above the surface of the dielectric region, the conductive element having a length along the surface of the dielectric region which is greater than the height, the conductive element at least partially embedded in the groove, the conductive element overlying the first planar surface of the substrate.