Preventing shorting dendritic migration between electrodes

摘要

In a general aspect, an integrated circuit package includes a first electrode and a second electrode on a support substrate. The first electrode and the second electrode are configured to be electrically coupled to a voltage differential. A dendritic migration of a migratory species can develop under the voltage differential and a non-hermetic environment. The dendritic migration is interrupted by a floating electrical barrier mounted onto the support substrate between the first electrode and the second electrode. The electrical barrier includes a dam for preventing the metal migration. The dam has a height approximately equal to or greater than the largest dimension of a single atom of the migratory species. The first electrode and the second electrode can be mounted on the same side of the support substrate, or on two opposite sides of the support substrate.

主权项

1. An integrated circuit package, comprising:
a first electrode and a second electrode on a support substrate made of a non-electrically conductive material, wherein the first electrode and the second electrode are configured to be electrically coupled to a voltage differential; and a floating electrical barrier comprising a dam made of an electrically conductive material mounted to the support substrate and located between the first electrode and the second electrode, the dam configured to prevent metal migration.