| 摘要 |
<p>The present invention relates to an apparatus for treating large-sized substrates with heat, comprising a frame part which is made by external frames and accordingly enables panels to be installed on the surface of the external frames; a heater part whose both end parts are fixed on the panel and which are arranged in the frame upward and downward and are installed at the same height to generate heat; and a supporting part which is not connected to the frame part and whose lower surface is supported by the heater part which is located at the same height of the supporting part, thereby enabling the substrate to be seated on the upper part of the supporting part. In the present invention, the size of the apparatus is reduced by minimizing the gap between the supporting part for supporting the substrate and heater part for treating the substrate supported by the supporting part where the apparatus can treat the number of the substrates more under the same height condition and accordingly increases productivity.</p> |
